首页 | 本学科首页   官方微博 | 高级检索  
   检索      


Behavior of protoplasm for survival in injured cells ofValonia ventricosa: involvement of turgor pressure
Authors:T Nawata  M Kikuyama  I Shihira-Ishikawa
Institution:(1) Biological Laboratory, The University of the Air, Chiba-shi;(2) Department of Biology, Tokyo Gakugei University, 184 Koganei-shi, Japan
Abstract:Summary By injuring cells ofValonia ventricosa, one of two survival strategies — wound-healing and protoplast formation — is induced. The present study revealed that turgor pressure, as well as Ca2+ in bathing medium, is involved in the choice between these survival strategies. On the process of wound-healing, turgor pressure is recovered in the presence of both the wound plug, which closes the wound immediately after an injury, and the aggregation of protoplasm around the wound, which serves to protect the inflow of outer medium into the protoplasm layer and also to strengthen the wound plug. When the size of the wound is more than 150 mgrm in diameter, the protoplasmic aggregate strengthen the wound plug incompletely and, as a result, wound-healing is unsuccessful. In this case, the ejection of vacuolar sap is repeated, due to partial restoration of turgor pressure. In each ejection, the wound plug is blown off, together with the aggregated protoplasm and, after several ejections are repeated, the cell is unable to heal the wound because of a lack of protoplasm around the wound. Continuous depression of turgor pressure, during the repeat of the unsuccessful wound-healing, induces disorganization of the protoplasm layer. Under these conditions, the centrifugal propagation of protoplasmic aggregation, followed by the protoplasts formation, takes place easily. Effects of turgor pressure and Ca2+ in the bathing medium upon the wound healing is discussed and the cytoplasmic behavior for survival of wounded cells is presented schematically.
Keywords:Protoplast formation  Turgor pressure  Valonia ventricosa  Wound-healing
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号