首页 | 本学科首页   官方微博 | 高级检索  
   检索      


Deformability and adhesive force of artificial platelets measured by atomic force microscopy
Authors:Toru Wada  Yosuke Okamura  Shinji Takeoka  Ryo Sudo  Yasuo Ikeda  Kazuo Tanishita
Institution:(1) Department of System Design Engineering, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan;(2) Department of Life Science and Medical Bioscience, Waseda University, 3-4-1 Ohkubo, Shinjuku-ku, Tokyo 169-8555, Japan;(3) Department of Biological Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139-4307, USA;(4) School of Medicine, Keio University, 35 Shinanomachi, Shinjuku-ku, Tokyo 160-8582, Japan
Abstract:Platelet glycoprotein GPIaIIa is an adhesive protein that recognizes collagen. We have investigated polymerized albumin particles conjugated with recombinant GPIaIIa (rGPIaIIa-poly Alb) for their platelet-like function. To evaluate the feasibility of these particles to achieve the hemostatic process, we measured the deformability (Young’s modulus and spring constant) and the adhesive force of the particles using atomic force microscopy, which can measure the mechanical properties of individual cells. Our results showed that the Young’s modulus of these particles was 2.3-fold larger than that of natural platelets and 12-fold larger than that of human red blood cells. The Young’s modulus of the particles may have been determined by the properties of the polymerized albumin particle, although the glycoprotein of the platelet surface also contributed to the higher modulus. Our results also showed that the adhesive force of the rGPIaIIa-poly Alb with the collagen ligand was 52% of that of natural platelets. These two mechanical properties (deformability and adhesive force) of cells or particles, such as rGPIaIIa-poly Alb, are important specifications for the optimum design of platelet substitutes.
Keywords:Adhesive force  Atomic force microscopy  Deformability  Glycoprotein GPIaIIa  Platelet substitutes  Thrombocytopenia  Young’  s modulus
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号