| Institution: | 1. Faculty of Engineering and Technology, Imam Khomeini International University, Qazvin, Iran;2. Electrical and Computer Engineering Department, Michigan Technological University, MI, USA;3. Department of Electrical Engineering, Science and Research Branch, Islamic Azad University, Tehran, Iran;1. Institut d’Investigacions Biomèdiques de Barcelona (IIBB, CSIC), Institut d’Investigacions Biomèdiques August Pi i Sunyer (IDIBAPS), c/Rosselló 161, 08036 Barcelona, Spain;2. Institut de Ciències de Materials de Barcelona (ICMAB, CSIC), Campus UAB, E-08193 Bellaterra, Barcelona, Spain;3. CIBER Epidemiología y Salud Pública (CIBERESP), Spain;1. Shanghai Key Laboratory of Orthopaedic Implants, Department of Orthopaedics, Shanghai Ninth People''s Hospital, Shanghai JiaoTong University School of Medicine, Shanghai, 200011, China;2. Department of Orthopaedics, Yuyao People''s Hospital of Zhejiang Province, Yuyao, Zhejiang, 315400, China;3. Department of Orthopaedics, The Second Hospital of Anhui Medical University, Hefei, Anhui, 230601, China;1. Engineering Research Center of Organosilicon Compounds & Materials, Ministry of Education, College of Chemistry and Molecular Sciences, Wuhan University, Wuhan 430072, PR China;2. Guangzhou Tianci Materials Technology Co., Guangzhou 510760, PR China;1. Departamento de Química, Universidade Estadual de Maringá, Avenida Colombo 5790, 87020-900 Maringá, Paraná, Brazil;2. Departamento de Ciências Básicas da Saúde, Universidade Estadual de Maringá, Av. Colombo, 5790, CEP 87020-900 Maringá, Paraná, Brazil;3. Programa de Pós-Graduação em Ciências Farmacêuticas, Departamento de Ciências Básicas da Saúde, Universidade Estadual de Maringá, Av. Colombo, 5790, CEP 87020-900 Maringá, Paraná, Brazil |
