Optimization of intravascular shear stress assessment in vivo |
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Authors: | Lisong Ai Hongyu Yu Wakako Takabe Anna Paraboschi Fei Yu E.S. Kim Rongsong Li Tzung K. Hsiai |
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Affiliation: | 1. Department of Radiology, Icahn School of Medicine at Mount Sinai, New York, NY, USA;2. Department of Radiology, Stanford University, Stanford, CA, USA;3. Department of Radiology and Imaging Sciences, Emory University School of Medicine, Atlanta, GA, USA |
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Abstract: | The advent of microelectromechanical systems (MEMS) sensors has enabled real-time wall shear stress (WSS) measurements with high spatial and temporal resolution in a 3-D bifurcation model. To optimize intravascular shear stress assessment, we evaluated the feasibility of catheter/coaxial wire-based MEMS sensors in the abdominal aorta of the New Zealand white (NZW) rabbits. Theoretical and computational fluid dynamics (CFD) analyses were performed. Fluoroscope and angiogram provided the geometry of aorta, and the Doppler ultrasound system provided the pulsatile flow velocity for the boundary conditions. The physical parameters governing the shear stress assessment in NZW rabbits included (1) the position and distance from which the MEMS sensors were mounted to the terminal end of coaxial wire or the entrance length, (Le), (2) diameter ratios of aorta to the coaxial wire (Daorta /Dcoaxial wire=1.5–9.5), and (3) the range of Reynolds numbers (116–1550). At an aortic diameter of 2.4 mm and a maximum Reynolds number of 212 (a mean Reynolds number of 64.2), the time-averaged shear stress (τave) was computed to be 10.06 dyn cm?2 with a systolic peak at 33.18 dyn cm?2. In the presence of a coaxial wire (Daorta /Dcoaxial wire=6 and Le=1.18 cm), the τave value increased to 15.54 dyn cm?2 with a systolic peak at 51.25 dyn cm?2. Real-time intravascular shear stress assessment by the MEMS sensor revealed an τave value of 11.92 dyn cm?2 with a systolic peak at 47.04 dyn cm?2. The difference between CFD and experimental τave was 18.5%. These findings provided important insights into packaging the MEMS sensors to optimize in vivo shear stress assessment. |
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