3D Profile Simulation of Metal Nanostructures Obtained by Closely Packed Nanosphere Lithography

Closely packed lithography is a versatile technology to fabricate different kinds of periodically arranged nanostructures on substrate or in solution. Due to its large diversities and versatilities, it is necessary to predict the shape of the nanostructures under various fabrication conditions. This paper gives a full simulation for the profile of metal nanostructures fabricated by closely packed nanosphere lithography. The simulation applies to both hexagonal and quadrangular nanosphere arrangements, and the nanospheres can be in one layer or stacked in two layers, with each layer having a different size. For metal evaporated at any angle onto the nanosphere mask, three-dimensional metal nanostructures on each layer of the nanosphere as well as the substrate are given. The simulation helps to obtain the desired metal nanostructures by predicting the profiles and facilitating the process design in closely packed lithography, and it is especially beneficial for finding out the profiles of the nanostructures hidden under the nanospheres, which are undetectable without removing the nanosphere layers.