Institution: | 1. Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, IL, USA;2. Center for Bio‐Integrated Electronics at the Simpson Querrey Institute for BioNanotechnology, and the Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA;3. Washington University Pain Center, and Department of Anesthesiology, Washington University School of Medicine, St. Louis, MO, USA;4. CREOL, The College of Optics and Photonics, and NanoScience Technology Center, University of Central Florida, Orlando, FL, USA;5. School of Materials Science and Engineering, Tsinghua University, Beijing, China;6. School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea;7. Department of Bioengineering, University of Illinois at Urbana–Champaign, Urbana, IL, USA;8. Department of Electronic Engineering, Tsinghua University, Beijing, China;9. Center for Bio‐Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, and Neurological Surgery, Simpson Querrey Institute for Nano/Biotechnology, McCormick School of Engineering and Feinberg, School of Medicine Northwestern University, Evanston, IL, USA |