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Cells under stress: a non-destructive evaluation of adhesion by ultrasounds
Authors:Myrdycz A  Callens Dorothée  Kot K  Monchau F  Radziszewski E  Lefebvre A  Hildebrand H F
Affiliation:Department of Opto-Acousto-Electronics (UMR CNRS 8520), North Institute of Electronics and Microelectronics (IEMN), University of Valenciennes, Le Mont Houy, 59313 Valenciennes Cedex 9, France.
Abstract:The adhesion process plays a major role in the development of osteoblastic cells on various substrates used in orthopaedic applications such as metals, bioceramics, or glass. High frequency and low power ultrasounds seem to be an appropriate tool for an evaluation of interface mechanical properties. Is it a non-destructive method? We investigated osteoblastic cell cultures, maintained in their medium with high frequency, bulk longitudinal waves. The influence of both acoustical frequency and acoustical power on cell adhesion is evaluated by cell detachment ratio and re-adhesion ratio. We demonstrate the existence of a power threshold depending on the frequency, allowing optimal cellular detachment and re-adhesion. Finally, a qualitative study of the detachment phenomena is performed by use of scanning electron microscopy (SEM), Confocal Laser Scanning Microscopy and cytochemical labelling.
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