Construction of one-, two- and three-dimensional Cu(I) polymeric architectures containing bis(diphenylphosphino)acetylene and 4,4′-bipyridine linking ligands |
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Authors: | Yu-Chiao Liu Gene-Hsiang Lee |
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Institution: | a Department of Chemistry, National Sun Yat-Sen University, 70 Lien-Hai Rd., Kaohsiung 804, Taiwan b Instrumentation Center, National Taiwan University, Taipei 106, Taiwan c Instrumentation Center, National Taiwan Normal University, Taipei 106, Taiwan |
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Abstract: | One-dimensional {Cu2(dppa)2(4,4′-bipy)(CH3CN)2](BF4)2 · 2CH3CN}n (1), two-dimensional {Cu2(dppa)(4,4′-bipy)2(CH3CN)2](BF4)2 · 4CH2Cl2 · 4H2O}n (2) and three-dimensional {Cu2(dppa)(4,4′-bipy)3](BF4)2 · 2CH2Cl2 · 3CH3CN · 3H2O}n (3) polymeric complexes have been prepared by self-assembly of Cu(MeCN)4]BF4, Ph2PCCPPh2 (dppa) and 4,4′-bipyridine (4,4′-bipy) in a 2:2:1, 1:1:1 and 2:2:3 molar ratio, respectively. The structures of 1-3, determined by an X-ray diffraction study, reveal a linear spring-like architecture for 1, a planar honeycomb grid for 2 and an interlocked adamantoid network for 3. |
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Keywords: | Coordination polymer Cu(I) complex Biphosphine ligand Bipyridine ligand |
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