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Enhanced cell viability and cell adhesion using low conductivity medium for negative dielectrophoretic cell patterning
Authors:Puttaswamy Srinivasu Valagerahally  Sivashankar Shilpa  Chen Rong-Jhe  Chin Chung-Kuang  Chang Hwan-You  Liu Cheng Hsien
Affiliation:Department of Power Mechanical Engineering, National Tsing Hua University, Hsin Chu, Taiwan.
Abstract:Negative dielectrophoretic (n-DEP) cell manipulation is an efficient way to pattern human liver cells on micro-electrode arrays. Maintaining cell viability is an important objective for this approach. This study investigates the effect of low conductivity medium and the optimally designed microchip on cell viability and cell adhesion. To explore the influence of conductivity on cell viability and cell adhesion, we have used earlier reported dielectrophoresis (DEP) buffer with a conductivity of 10.2 mS/m and three formulated media with conductivity of 9.02 (M1), 8.14 (M2), 9.55 (M3) mS/m. The earlier reported isotonic sucrose/dextrose buffer (DEP buffer) used for DEP manipulation has the drawback of poor cell adhesion and cell viability. A microchip prototype with well-defined positioning of titanium electrode arrays was designed and fabricated on a glass substrate. The gap between the radial electrodes was accurately determined to achieve good cell patterning performance. Parameters such as dimension of positioning electrode, amplitude, and frequency of voltage signal were investigated to optimize the performance of the microchip.
Keywords:Cell adhesion  Cell patterning  Medium conductivity  Negative dielectrophoresis  Osmolarity
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