Cu/PAA的制备及其抗菌性能研究

采用两步阳极氧化法制备出孔径为75nm的多孔阳极氧化铝(PAA75),并使用交流电沉积技术在PAA75孔道内装载纳米Cu。采用场发射扫描电镜(FESEM)观察样品微观形貌,进一步采用X射线衍射(XRD)、X射线光电子能谱分析(XPS)对材料化学组成及晶型进行了表征和分析。选用大肠杆菌(E.coli ATCC 8099)和金黄色葡萄球菌(S.aureus ATCC6538)测试Cu/PAA的抗菌性能。研究结果表明,本方法制备的Cu/PAA中Cu主要以Cu0存在,并且Al和Cu所占原子比为17.77∶0.71。体外抗菌测试表明,Cu(10s)/PAA对E.coli的1d、2d和3d抑菌率分别为82%±11%、78%±7%和45%±4%,对S.aureus的1d、2d和3d抑菌率分别为89%±4%、75%±8%和56%±11%。

Preparation and antibacterial activity of Cu/PAA

The porous anodic aluminum with nanopore diameter of 75 nm was fabricated by two-step anodic oxidation method, and then the nano-Cu was then filled into the pores of PAA75 by AC electrodeposition technique. The morphology of samples was observed by field emission scanning electron microscope (FESEM). The composition and crystal form of the Cu/PAA were characterized by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Escherichia coli ( E.coli ATCC 8099) and Staphylococcus aureus (S.aureus ATCC 6538) were used to test the antibacterial property of PAA and Cu/PAA. Experimental results showed that nano-Cu supported on PAA mainly existed in Cu 0. The atomic ratio of Al to Cu was 17.77 ∶0.71. Antibacterial tests in vitro showed that Cu/PAA had antibacterial properties to E.coli with the antibacterial rates of 82%±11%, 78%±7% and 45%±4%, and S.aureus with the antibacterial rates of 89%±4%, 75%±8% and 56%±11%, at 1 d, 2 d and 3 d, respectively.